Electronic Components

WDM technologies

edited by Achyut K. Dutta, Niloy K. Dutta, Masahiko Fujiwara.

Nanostructure physics and fabrication: proceedings of the international symposium, College Station, Texas, March 13-15, 1989

edited by Mark A. Reed, Wiley P. Kirk.

Electrical performance of electronic packaging: October 27-29, 1997, The Wyndham Hotel, San Jose, California

sponsored by the IEEE Microwave Theory and Techniques Society and the IEEE Components, Packaging and Manufacturing Technology Society.

18th International Conference on Thermoelectrics

International Conference on Thermoelectrics (18th 1999 Baltimore, Md.), Institute Of Electrical and Electronics Engineers, M.D.) International Conference on Thermoelectrics (18th : 1999 : Baltimore

An Analog Electronics Companion: Basic Circuit Design for Engineers and Scientists

Scott Hamilton

Electricity and Electronics for HVAC

Rex Miller, Mark R. Miller

Electronic Components and Technology Conference, 1999 IEEE 49th: IEEE Components, Packaging, and Manufacturing Technology Society, Sponsor(S (Electronic ... and Technology Conference//Proceedings)

Institute Of Electrical and Electronics Engineers, IEEE Components

Ferroelectric thin films III: symposium held April 13-16,1993, San Francisco, California, U.S.A.

editors, Edward R. Myers, Bruce Tuttle ... [et al.].

Hardening semiconductor components against radiation and temperature

William R. Dawes, Jr., ... [et al.].

Electronic Components: Selection and Application Guidelines

Victor Meeldijk