Solutions to CFD benchmark problems in electronic packaging
presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993
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Contributions
- Agonafer, D. - Contributor
- American Society of Mechanical Engineers. Heat Transfer Division. - Contributor
Publication
1993 - American Society of Mechanical Engineers, New York, N.Y, New York (State)
Language
English
Word Count
14,250 words, Guess
Page Count
57 pages
Identifiers
- ISBN-100791811689
- ISBN-139780791811689
- Goodreads3719934
- Library of Congress Control Number93079494
- Open LibraryOL1443933M
Classifications
- DDC621.381/046
- LCCTK7870.15 .N38 1993
Subjects
Series Statement
- HTD ;
- vol. 255
- HTD (Series) ;
- v. 255.
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