Multichip modules
international conference and exhibition, 13-15 April 1994, Denver, Colorado
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Contributions
- International Society for Hybrid Microelectronics. - Contributor
- Semiconductor Equipment and Materials International. - Contributor
- International Electronics Packing Society. - Contributor
- Institute for Interconnecting and Packaging Electronic Circuits (Evanston, Ill.) - Contributor
- Society of Photo-optical Instrumentation Engineers. - Contributor
and 1 more
- International Conference and Exhibition on Multichip Modules (3rd : 1994 : Denver, Colo.) - Contributor
Publication
1994 - Published in cooperation with SPIE--the International Society for Optical Engineering, Reston, Va, Virginia
Language
English
Word Count
157,500 words, Guess
Page Count
630 pages
Identifiers
- ISBN-100930815394
- ISBN-139780930815394
- Library of Congress Control Number2004296963
- OCLC Control Number31859876
- Open LibraryOL3324038M
Classifications
- DDC621.381/046
- LCCTK7870.15 .M82 1994
- LCCTK7874 .I567 1993
Alternate Titles
- 1994 proceedings International Conference and Exhibition on Multichip Modules.
Subjects
Genres
- Congresses
Series Statement
- SPIE proceedings series ;
- v. 2256
- Proceedings of SPIE--the International Society for Optical Engineering ;
Other Editions
- Multichip modules
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