Author

Publication

1995 - Springer Vienna, Vienna, Austria

Language

English

Word Count

49,000 words, Guess

Page Count

196 pages

Physical Format

Electronic resource

Identifiers

  • Internet Archivedimensionalproce00fuji
  • ISBN-103709174309
  • ISBN-103709169054
  • ISBN-139783709174302
  • ISBN-139783709169056
and 4 more
  • OCLC Control Number851383256
  • Better World Books9783709174302
  • Better World Books9783709169056
  • Open LibraryOL27032520M

Classifications

  • LCCQA76.9.C65
  • DDC621.381
  • LCCTK7800-8360
and 2 more
  • LCCTK7874-7874.9
  • LCCQA75.5-76.95

Description

Whereas two-dimensional semiconductor process simulation has achieved a certain degree of maturity, three-dimensional process simulation is a newly emerging field in which most efforts are dedicated to necessary basic developments. Research in this area is promoted by the growing demand to obtain reliable information on device geometries and dopant distributions needed for three-dimensional device simulation, and challenged by the great algorithmic problems caused by moving interfaces and by the requirement to limit computation times and memory requirements. A workshop (Erlangen, September 5, 1995) provided a forum to discuss the industrial needs, technical problems, and solutions being developed in the field of three-dimensional semiconductor process simulation. Invited presentations from leading semiconductor companies and research Centers of Excellence from Japan, the USA, and Europe outlined novel numerical algorithms, physical models, and applications in this rapidly emerging field.

Subjects

Other Editions

  • 3-Dimensional Process SimulationElectronic resourceSpringer Vienna1995-01-01

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