Multichip modules
international conference and exhibition, 14-16 April 1993, Denver, Colorado
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Contributions
- International Society for Hybrid Microelectronics. - Contributor
- International Electronics Packaging Society. - Contributor
- International Conference and Exhibition on Multichip Modules (2nd : 1993 : Denver, Colo.) - Contributor
Publication
1993 - Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering, Bellingham, Wash, Washington (State)
Language
English
Word Count
151,000 words, Guess
Page Count
604 pages
Identifiers
- Open LibraryOL1134671M
- ISBN-100930815378
- OCLC Control Number30032036
- OCLC Control Numbermultichipmodules0000unse_b8x8
- Library of Congress Control Number94101200
Classifications
- DDC621.381/046
- LCCTK7870.15 .M83 1993
- LCCTK7870.15 .I57 1993
Subjects
Topics
Series Statement
- Proceedings ;
Other Editions
- Multichip modules: international conference and exhibition, 14-16 April 1993, Denver, Colorado
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