Contributions

  • International Society for Hybrid Microelectronics. - Contributor
  • International Electronics Packaging Society. - Contributor
  • International Conference and Exhibition on Multichip Modules (2nd : 1993 : Denver, Colo.) - Contributor

Publication

1993 - Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering, Bellingham, Wash, Washington (State)

Language

English

Word Count

151,000 words, Guess

Page Count

604 pages

Identifiers

Classifications

  • DDC621.381/046
  • LCCTK7870.15 .M83 1993
  • LCCTK7870.15 .I57 1993

Subjects

Series Statement

  • Proceedings ;

Other Editions

  • Multichip modules: international conference and exhibition, 14-16 April 1993, Denver, ColoradoPublished by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering1993-01-01

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