Application of fracture mechanics in electronic packaging
presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
Our rough guess is there are 48,250 words in this book.
At a pace averaging 250 words per minute, this book will take 3 hours and 13 minutes to read. With a half hour per day, this will take 7 days to read.
How long will it take you?
This book will take an estimated to read at a reading speed averaging words per minute. With 30 minutes per day, this will take to read.
Enter your reading speedYou can take one of our WPM reading speed tests to find your reading speed.
Create a free account to track your reading progress, build your reading list, and set reading goals.
We earn a commission on purchases
Author
Contributions
- Chen, William T. - Contributor
- Read, D. T. - Contributor
- American Society of Mechanical Engineers. Applied Mechanics Division. - Contributor
- American Society of Mechanical Engineers. Electrical and Electronic Packaging Division. - Contributor
- International Mechanical Engineering Congress and Exposition (1997 : Dallas, Tex.) - Contributor
and 1 more
- Symposium on Application of Fracture Mechanics in Electronic Packaging (1997 : Dallas, Tex.) - Contributor
Publication
1997 - American Society of Mechanical Engineers, New York, N.Y, New York (State)
Language
English
Alternate Titles
- Fracture mechanics in electronic packaging
Subjects
Topics
Series Statement
- AMD ;
Other Editions
- Application of fracture mechanics in electronic packaging
Reader Reviews
No reviews yet for this book.
Be the first to share your thoughts!