Low Dielectric Constant Materials for IC Applications
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Author
Contributions
- Leu, Jihperng Jim - Contributor
- Lee, Wei William - Contributor
Publication
2003 - Springer Berlin Heidelberg, Berlin, Heidelberg, Germany
Language
English
Word Count
77,500 words, Guess
Page Count
310 pages
Physical Format
Electronic resource
Identifiers
- Internet Archivelowdielectriccon00hops
- ISBN-103642632211
- ISBN-103642559085
- ISBN-139783642632211
- ISBN-139783642559082
and 4 more
- OCLC Control Number851748124
- Better World Books9783642632211
- Better World Books9783642559082
- Open LibraryOL27071845M
Classifications
- DDC620.11295
- DDC620.11297
- LCCTA1750-1750.22
and 1 more
- LCCTK7800-8360
Description
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
Subjects
Series Statement
- Springer Series in Advanced Microelectronics -- 9
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