Author

Contributions

  • Leu, Jihperng Jim - Contributor
  • Lee, Wei William - Contributor

Publication

2003 - Springer Berlin Heidelberg, Berlin, Heidelberg, Germany

Language

English

Word Count

77,500 words, Guess

Page Count

310 pages

Physical Format

Electronic resource

Identifiers

  • Internet Archivelowdielectriccon00hops
  • ISBN-103642632211
  • ISBN-103642559085
  • ISBN-139783642632211
  • ISBN-139783642559082
and 4 more
  • OCLC Control Number851748124
  • Better World Books9783642632211
  • Better World Books9783642559082
  • Open LibraryOL27071845M

Classifications

  • DDC620.11295
  • DDC620.11297
  • LCCTA1750-1750.22
and 1 more
  • LCCTK7800-8360

Description

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

Subjects

Series Statement

  • Springer Series in Advanced Microelectronics -- 9

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