Contributions

  • Culham, J. Richard. - Contributor
  • Kromann, Gary B. - Contributor
  • Ramakrishna, Koneru. - Contributor
  • Components, Packaging & Manufacturing Technology Society. - Contributor

Publication

2002 - IEEE, Piscataway, N.J, New Jersey

Language

English

Word Count

278,750 words, Guess

Page Count

1,115 pages

Identifiers

  • ISBN-100780371526
  • ISBN-100780371534
  • ISBN-139780780371521
  • ISBN-139780780371538
  • OCLC Control Number50234650
and 1 more

Alternate Titles

  • Thermal and thermomechanical phenomena in electronic systems.
  • Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
  • Thermal and Thermomechanical Phenomena in Electronic Systems, 2002, ITHERM 2002, the Eighth Intersociety Conference on.

Subjects

Genres

  • Congresses

Links

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