Microelectronics packaging handbook
2nd ed.
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Contributions
- Tummala, Rao R., 1942- - Contributor
- Rymaszewski, Eugene J. - Contributor
Publication
1997 - Chapman & Hall, New York, New York (State)
Language
English
Word Count
0 words, Guess
Page Count
0 pages
Identifiers
- ISBN-100412084317
- ISBN-100412084414
- ISBN-100412084511
- ISBN-139780412084317
- ISBN-139780412084416
Classifications
- DDC621.381/046
- LCCTK7874 .M485 1997
Subjects
Topics
TechnologyElectronicsMicroelectronicsHandbooks, manualsElectronic packagingMicroelectronic packagingMicroelectronic packaging -- Handbooks, manuals, etcTecnicas gerais de fabricacao de circuitos integrados
Other Editions
- Microelectronics packaging handbook
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