Area Array Packaging Processes
for BGA, Flip Chip, and CSP
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Word Count
64,750 words, Guess
Page Count
259 pages
Identifiers
- Internet Archiveareaarraypackagi0000unse
- ISBN-100071428291
- ISBN-139780071428293
- Goodreads1589141
- Library of Congress Control Number2004042860
and 2 more
- Better World Books9780071428293
- Open LibraryOL7300247M
Classifications
- LCCTK7870.16
- LCCTK7874 .A72 2004
First Sentence
One of the significant developments to improve cost, reliability, and productivity in the electronic packaging industry has been flip chip (FC) technology.
Other Editions
- Area Array Packaging Processes: for BGA, Flip Chip, and CSP
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