Multichip modules (Microelectr

1993 IEEE Multi-Chip Module Conference McMc-93: March 15-18, 1993 Santa Cruz, California: Proceedings

Institute Of Electrical and Electronics Engineers

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

John H. Lau

Electronics Packaging Forum

James E. Morris

MCM C/Mixed Technologies and Thick Film Sensors (NATO Science Partnership Sub-Series: 3:)

NATO Advanced Research Institute on Ceramic/Mixed Mode Multi-Chip Modules (MCM) (1994 Islamorada, Fla.)

1992 IEEE Multi-Chip Module Conference McMc-92, Proceedings, March 18-20, 1992, Santa Cruz, California

IEEE Circuits and Systems Society

Microelectronic System Interconnections: Performance and Modeling/Pc0300-4

Stuart K. Tewksbury

Application of fracture mechanics in electronic packaging: presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.

Area Array Packaging Processes: for BGA, Flip Chip, and CSP

Ken Gilleo

Routing in the Third Dimension: From Vlsi Chips to McMs

N. A. Sherwani, Siddharth Bhingarde, Anand Panyam

Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems)

William D. Brown